Sharp's newly developed 3D-SiP with 0.5 mm ball pitch reduces mounting surface by 42 percent

Initial applications for the innovative LSI Chip system are digital camerasHamburg, September 9, 2005 – The Sharp Corporation is the first manufacturer in the industry to develop a 0.5 mm ball pitch technology for 3D systems-in-package (3D-SiP). What has been very difficult to implement with conventional SiP technologies is now possible thanks to this innovation: the stacking of DSP, Flash memory and SDRAM in one stack with 14 x 14 mm edge length and 1.7 mm in height. The bottom module contains the DSP on one substrate of only 0.25 mm in height and fits perfectly into the gap created by the 0.5 mm ball pitch. The second module, which integrates one 32 Mbit Flash memory and one or two 256 Mbit SDRAMs, is placed on top of it. This means that logic and memory ICs only need 58 percent of the mounting surface, compared to the normal approach of placing the DSP and the memory (Flash and SDRAM) in two separate housing stacks.

Sharp will initially launch on the market two LSI systems (LR38683 and the LR38682) that are specifically designed for digital cameras in the 3-10 megapixel range. But manufacturers of mobile devices such as mobile phones and PDAs will also benefit from the new 3D-SiP technology because it facilitates the design-in of high performance LSI systems with the same space needs. Another advantage of the 3D-SiP technology is its far-reaching flexibility. Depending on the specific requirements of the application, the various modules (memory units or highly functional multi-pin circuits such as Logic ICs) can be combined in different configurations. Therefore, for digital cameras, the memory function can vary in accordance to the resolution of the CCD camera module.

Specifications

Models: LR38683 / LR38682
- Operating voltage: 3.0 to 3.6 V
- Configuration: DSP, 32-MB-Flash memory, 256-MB-SDRAM x 2 / DSP, 32-MB-Flash memory, 256-MB-SDRAM x 1
- DSP pixel range: 3 to 10 million
- Flash memory access time: 100 ns
- SDRAM pulsing: 100 MHz
- Housing size: 14 x 14 x 1.7 mm (TYP)

Availability

Samples of the two LSI systems, the LR38683 and the LR38682, are available immediately worldwide from Sharp sales outlets and distribution partners. Serial production is scheduled to start in July 2005.

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About Sharp Microelectronics Europe

Sharp Microelectronics Europe, Hamburg, Germany, is a divisional company of Sharp Electronics (Europe) GmbH, which is a subsidiary of Sharp Corporation, Osaka, Japan. Sharp is a worldwide developer of core digital technologies that are playing an integral role in shaping the next generation of electronic products for consumer and business needs. Sharp Microelectronics Europe offers groundbreaking solutions in the areas of memory products, LCD, Opto Components, CCD, RF/IR, microcomputer and system-on-chip components, along with packaging and integration skills that help design engineers throughout Europe to bring their ambitious ideas to market. Sharp Microelectronics Europe is dedicated to improving people’s lives through the use of advanced technology and a commitment to innovation, quality, value and design.

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